Digimat is the state-of-the-art multiscale material modelling platform focusing on the micromechanical modelling of complex multiphase materials such as plastics, composites, metals, and elastomers, revealing how they perform at part and system levels. Digimat bridges the gap between materials, manufacturing processes, and structural part performance to design innovative high-performance products while minimizing weight, cost and time-to-market.
Digimat solutions form a holistic system based on three pillars:
Multiscale material simulations give insights into microscopic mechanisms that dominate the material macroscopic properties, empowering scientists and engineers with an accurate understanding of complex material behaviors. Multiphysics performance of composite materials, reinforced plastics, foams, metallic and many other material systems can be predicted by virtual testing of material properties and microstructures.
2. Multiscale simulations– To enrich FEA and connect materials, manufacturing and performances
The Digimat solution, empowered by Integrated Computational Materials Engineering (ICME), enriches CAE analyses by intrinsically connecting the manufacturing process, material properties and structural part performance. Manufacturing processes, ranging from injection and compression Moulding, draping, thermoforming, additive manufacturing and many more, induce local microstructures, residual stresses and defects. These are captured by Digimat material models bridging the gap between the manufacturing process and structural part performance, making design simulations more accurate and reliable.
3. Polymer Additive manufacturing– Focusing on polymers and composites
Digimat offers a dedicated solution for additive manufacturing of plastics and composite materials. It helps process engineers anticipate and overcome manufacturing issues with the adoption of warpage compensation strategies that enable first time right prints. Sensitivity analyses allow to assess the effect of process parameters on the prediction of warpage, residual stresses, temperature fields, crystallinity evolutions, layer adhesion, porosity and many more.